Characterization of the mechanical and thermal interface of copper films on carbon substrates modified by boron based interlayersSCHAFER, D; EISENMENGER-SITTNER, C; CHIRTOC, Mihai et al.Surface & coatings technology. 2011, Vol 205, Num 12, pp 3729-3735, issn 0257-8972, 7 p.Article

Lens barrel heat transfer: An improvement methodLIU, Wei-Yi; JIA, Ji-Qiang.Applied thermal engineering. 2013, Vol 54, Num 1, pp 78-84, issn 1359-4311, 7 p.Article

Thermal contact resistance estimation and metallurgical transformation identification during the hot stampingBLAISE, Alexandre; BOUROUGA, Brahim; ABDULHAY, Bakri et al.Applied thermal engineering. 2013, Vol 61, Num 2, pp 141-148, issn 1359-4311, 8 p.Article

Thermal contact resistance between the surfaces of silicon and copper crucible during electron beam meltingSHUTAO WEN; YI TAN; SHUANG SHI et al.International journal of thermal sciences. 2013, Vol 74, pp 37-43, issn 1290-0729, 7 p.Article

3-D temperature and stress distributions of strip in preheating furnace of continuous annealing lineCHEN, Tei-Chen; HO, Chang-Hsien; LIN, Jia-Ching et al.Applied thermal engineering. 2010, Vol 30, Num 8-9, pp 1047-1057, issn 1359-4311, 11 p.Article

A 3D computational model of heat transfer coupled to phase change in multilayer materials with random thermal contact resistanceAMARA, M; TIMCHENKO, V; EL GANAOUI, M et al.International journal of thermal sciences. 2009, Vol 48, Num 2, pp 421-427, issn 1290-0729, 7 p.Article

Advanced two-channel ac calorimeter for simultaneous measurements of complex heat capacity and complex thermal conductivityMINAKOV, A. A; ADAMOVSKY, S. A; SCHICK, C et al.Thermochimica acta. 2003, Vol 403, Num 1, pp 89-103, issn 0040-6031, 15 p.Conference Paper

Thermal contact resistance in plate fin-and-tube heat exchangers, determined by experimental data and CFD simulationsTALER, Dawid; OCLON, Paweł.International journal of thermal sciences. 2014, Num 84, pp 309-322, issn 1290-0729, 14 p.Article

Influences of temperature and contact pressure on thermal contact resistance at interfaces at cryogenic temperaturesDONGMEI BI; HUANXIN CHEN; YE TIAN et al.Cryogenics (Guildford). 2012, Vol 52, Num 7-9, pp 403-409, issn 0011-2275, 7 p.Article

On the aptitude of the lattice Boltzmann approach for the treatment of the transient heat transfer with crack resistanceEL GANAOUI, M; ADDAKIRI, S; SEMMA, E et al.Comptes rendus. Mécanique. 2012, Vol 340, Num 7, pp 518-525, issn 1631-0721, 8 p.Article

Full deconvolution of the instrumental coefficients in scanning calorimeter of heat flux typeTODA, Akihiko; HIKOSAKA, Masamichi.Thermochimica acta. 2005, Vol 436, Num 1-2, pp 15-25, issn 0040-6031, 11 p.Article

A new model for thermal contact resistance between fuel cell gas diffusion layers and bipolar platesSADEGHIFAR, Hamidreza; DJILALI, Ned; BAHRAMI, Majid et al.Journal of power sources (Print). 2014, Vol 266, pp 51-59, issn 0378-7753, 9 p.Article

Reducing thermal contact resistance using a bilayer aligned CNT thermal interface materialWANG, H; FENG, J. Y; HU, X. J et al.Chemical engineering science. 2010, Vol 65, Num 3, pp 1101-1108, issn 0009-2509, 8 p.Article

Numerical simulation and theoretical analysis of thermal boundary characteristics of convection heat transfer in porous mediaJIANG, Pei-Xue; LU, Xiao-Chen.International journal of heat and fluid flow. 2007, Vol 28, Num 5, pp 1144-1156, issn 0142-727X, 13 p.Article

Comparison and validation of thermal contact resistance models at solid―liquid interface taking into account the wettability parametersSOME, Saannibe Ciryle; DELAUNAY, Didier; GAUDEFROY, Vincent et al.Applied thermal engineering. 2013, Vol 61, Num 2, pp 531-540, issn 1359-4311, 10 p.Article

Numerical study of the solidification of successive thick metal layersLE BOT, Cédric; ARQUIS, Eric.International journal of thermal sciences. 2009, Vol 48, Num 2, pp 412-420, issn 1290-0729, 9 p.Article

Modelling of thermal contact resistance within the framework of the thermal lattice Boltzmann methodHAN, K; FENG, Y. T; OWEN, D. R. J et al.International journal of thermal sciences. 2008, Vol 47, Num 10, pp 1276-1283, issn 1290-0729, 8 p.Article

Thermal behaviour of a multilayer media in transient regimeTAMENE, Y; BOUGRIOU, C; BESSAIH, R et al.Revue des énergies renouvelables. 2007, Vol 10, Num 3, pp 397-405, issn 1112-2242, 9 p.Article

Direct measurement of through-plane thermal conductivity and contact resistance in fuel cell materialsKHANDELWAL, Manish; MENCH, M. M.Journal of power sources. 2006, Vol 161, Num 2, pp 1106-1115, issn 0378-7753, 10 p.Article

The effect of thermal contact resistance on heat management in the electronic packagingGRUJICIC, M; ZHAO, C. L; DUSEL, E. C et al.Applied surface science. 2005, Vol 246, Num 1-3, pp 290-302, issn 0169-4332, 13 p.Article

A predictive model for the evolution of the thermal conductance at the casting-die interfaces in high pressure die castingHAMASAIID, A; DOUR, G; LOULOU, T et al.International journal of thermal sciences. 2010, Vol 49, Num 2, pp 365-372, issn 1290-0729, 8 p.Article

Modelling the nucleation process in alumina lamellae deposited on a steel substrateLAHMAR-MEBDOUA, Y; VARDELLE, A; FAUCHAIS, P et al.International journal of thermal sciences. 2010, Vol 49, Num 3, pp 522-528, issn 1290-0729, 7 p.Article

Thermal contact resistance estimation at the blank/tool interface: experimental approach to simulate the blank cooling during the hot stamping processBAKRI ABDUL HAY; BOUROUGA, Brahim; DESSAIN, Christine et al.International journal of material forming. 2010, Vol 3, Num 3, pp 147-163, issn 1960-6206, 17 p.Article

Modelling of heat transfer between two rollers in dry frictionHAMRAOUI, M; ZOUAOUI, Z.International journal of thermal sciences. 2009, Vol 48, Num 6, pp 1243-1246, issn 1290-0729, 4 p.Article

Effect of electroplating on the thermal conductance of fin-tube interfaceCHENG, Wui-Wai; MADHUSUDANA, Chakravarti.Applied thermal engineering. 2006, Vol 26, Num 17-18, pp 2119-2131, issn 1359-4311, 13 p.Article